-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
December 22, 2023 | Cadence Design SystemsEstimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Wistron, a leading technical service provider (TSP), has adopted and deployed the new AI-driven electromagnetic (EM) in-design analysis workflow, including the Cadence® Optimality™ Intelligent System Explorer and the Cadence Clarity™ 3D Solver, to design a complex 800G network switch. Using the Optimality Explorer’s AI-driven optimization technology and the Clarity 3D Solver for fast, accurate and scalable EM in-design analysis, Wistron was able to analyze large volumes of data—improving overall design reliability while realizing a 2X improvement in turnaround time (TAT).
Legacy 3D solvers typically deliver slower simulation results due to excessive run times and memory usage. In contrast, the Clarity 3D Solver, with its distributed multiprocessing technology and virtually unlimited capacity, quickly analyzes large and complex PCB, IC packaging and complete systems without compromising accuracy. Its exceptional performance is further fueled by the Optimality Explorer, a generative AI-driven, in-design multiphysics system analysis and optimization solution that allows design engineers to explore 3D EM and high-speed signal and power integrity results efficiently and effectively. By revealing design configurations that may not be manually achievable, the Optimality Explorer streamlines design iterations—resulting in shorter and more efficient design cycles.
“By adopting Cadence’s AI-driven optimization solution including Optimality Explorer alongside the Clarity 3D Solver for our 800G network switch and GPU server, we leveraged the design of experiments model to explore multiple simulations quickly and realized far more robust designs with a 2X improvement in TAT,” said Christopher Huang, vice president of the Enterprise and Networking Business Group at Wistron. “With a shift left of AI-enabled multiphysics systems analysis into our electronic design workflow, we are not only improving product performance but gaining valuable design insight and engineering efficiencies.”
“As high-speed electronic systems continue to grow in complexity to meet market demands, Cadence is committed to developing software solutions that address multiphysics challenges and the associated scaling demands,” said Ben Gu, corporate vice president of the Multiphysics System Analysis Group at Cadence. “Wistron has embraced the Cadence multiphysics system analysis portfolio to expedite design throughput and engineering turnaround time. The Clarity and Optimality solutions, coupled with HPC, are the trifecta for next-generation design success.”
The Clarity 3D Solver and the Optimality Explorer support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Suggested Items
A Potpourri of Design PD Classes
05/14/2024 |What is invention without innovation? What is innovation without capability? Kelly Dack addresses these questions and more in this review of the Professional Development courses at IPC APEX EXPO, including the flex course lead by "Flexperts" Mark Finstad and Nick Koop.
Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point
05/14/2024 | Real Time with...IPC APEX EXPOIn an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
05/14/2024 | I-Connect007 Editorial TeamDo you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.
Redwire Announces Development of New European-Built Very Low Earth Orbit (VLEO) Spacecraft Platform called Phantom
05/13/2024 | BUSINESS WIRERedwire Corporation, a leader in space infrastructure for the next generation space economy, announced Phantom, a new European Very Low Earth Orbit (VLEO) spacecraft platform.
Emerald Technologies Acquires Optimum
05/13/2024 | Emerald TechnologiesEmerald Technologies announced its acquisition of Optimum Design Associates, Inc. (Optimum), a leading electronic design and engineering services company. Terms were not disclosed.