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HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024

05/20/2024 | TrendForce
TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year.

SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea

05/14/2024 | BUSINESS WIRE
SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.

HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total DRAM Value

05/06/2024 | TrendForce
Avril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI chips.

Demand for NVIDIA’s Blackwell Platform Expected to Boost TSMC’s CoWoS Total Capacity by Over 150% in 2024

04/16/2024 | TrendForce
NVIDIA’s next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA’s own Grace Arm CPU in models such as the GB200, represents a significant development.

2024 HBM Supply Bit Growth Estimated to Reach 260%, Making Up 14% of DRAM Industry

03/18/2024 | TrendForce
TrendForce reports that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. Senior Vice President Avril Wu notes that by the end of 2024, the DRAM industry is expected to allocate approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth of around 260%
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