Today’s designers are challenged more than ever with the task of finding the optimal balance between cost and performance when designing radio frequency/microwave PCBs.
Written by John Bushie, director of technology at American Standard Circuits, and Anaya Vardya, president and CEO, this micro eBook provides information needed to understand the unique challenges of RF PCBs. The authors answer two main questions: what is the correct material to use for a particular project, and what can be done at the design stage to make a product more manufacturable?
Readers, especially RF PCB designers, will gain a better understanding of issues related to the design and manufacture of RF/microwave devices from a PCB fabricator perspective.
ISBN#: 978-0-9998648-0-7
John has over 20 years of experience in the PCB industry supplying and supporting the manufacture of PCBs as well as high-frequency RF/microwave circuit board laminates. He has provided product and design support to PCB and system designers throughout North America, Europe, and Asia. His extensive background in problem solving and process engineering has allowed him to support many customers through detailed and focused application engineering. It is this close relationship with customers that drives his passion for new product design and design for manufacturability.
Anaya Vardya
Anaya has over 33 years of experience in electronics manufacturing, including in the United States, Canada, and the Far East. He also has over a decade of executive management experience in public companies manufacturing PWBs. One of Anaya's peers, Brad Hammack of Dell EMC, described him as "…one of the most driven engineering managers I have ever worked with. He has a keen eye for details and also sees the big picture." He has an extensive understanding of virtually every aspect of PCB manufacturing operations, such as supply chain management and quality control. Anaya not only serves as ASC's CEO, but also as an expert ready to assist you with any questions you may have.
American Standard Circuits (ASC) and Sunstone Circuits have joined forces to create a formidable entity in PCB manufacturing, leveraging over 50 years of combined industry expertise. This unified collaboration harnesses ASC's comprehensive solutions expertise and Sunstone's focus on rapid turnaround, top-quality PCBs, and unparalleled customer support.
Our commitment extends to providing a diverse range of PCB types customized for various industries, including military/aerospace, industrial, commercial, medical, telecommunications, consumer electronics, RF/microwave, and transportation sectors. ASC-Sunstone stands as a hub for excellence in PCB manufacturing, simplifying procurement while delivering top-notch products.
At the forefront of technology, our ongoing research and development in thermal management and embedded passive components enable us to meet the demands of ever-evolving computing devices. Our specialties encompass hybrid circuits, exotic materials, blind and buried vias, controlled impedance, and patented thermal management solutions.
Quality is our hallmark. ASC holds certifications such as AS9100 Rev. C, ISO 9001:2008, and MIL PRF 31032, reinforced by state-of-the-art process control systems. Rigorous SPC controls, automated optical inspection, metallographic cross-section, and electrical test facilities ensure we meet and exceed the high standards set by our customers.
We understand the urgency of timelines in the industry. ASC-Sunstone prides itself on quick-turn capabilities across all our manufacturing technologies. Our cutting-edge front-end engineering CAM systems and rapid-response manufacturing processes enable us to provide swift solutions for our customers.
For more information on our wide range of offerings and quick-turn options, visit www.ascsunstone.com. Together, ASC and Sunstone set a new standard of excellence in PCB manufacturing, offering unmatched expertise, support, and top-quality products across diverse industry sectors.
Happy Holden Consulting Technical Editor,
I-Connect007
Happy Holden is the retired director of electronics and innovations for GENTEX Corporation. Formerly, he was the chief technical officer for the world’s largest PCB fabricator—Hon Hai Precision Industries (Foxconn). Prior to Foxconn, Holden was the senior PCB technologist for Mentor Graphics and [...]
Chapter Summaries
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Chapter 1
Chapter 1: Material Selection
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Chapter 2
Chapter 2: Copper Surface Roughness
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Chapter 3
Chapter 3: RF PCB Layer Stackup
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Chapter 4
Chapter 4: Via Structures
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Chapter 5
Chapter 5: Impact of Copper Thickness Based on Structures of the PCB
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Chapter 6
Chapter 6: Edge Plating
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Chapter 7
Chapter 7: Cavity Constructions
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Chapter 8
Chapter 8: Thermal Management